Used BUEHLER Fibrpol 3000 #9043229 for sale

BUEHLER Fibropol 3000 is a high-precision, automated wafer grinding, lapping, and polishing equipment. This three-stage system is designed to reduce surface irregularities and produce optically flat substrates quickly and easily. The Fibropol 3000 consists of three main components: a spindle, a workstation, and a control module. The spindle is the main mechanical component of the unit, and it is designed to ensure repeatable, accurate grinding, lapping, and polishing processes. The spindle features a variable-speed drive, allowing for multiple process parameters, such as up/down motion, speed, pressure, and lift to be set and altered as desired. Additionally, the spindle can be equipped with a variety of consumables, such as polishing cloths and diamond tools, for specific processing tasks. The workstation is where the actual grinding, lapping, and polishing processes occur. It is designed to accommodate multiple wafers of various shapes and sizes. This component also includes a platform for mounting and positioning the wafers in contact with the consumables mounted on the spindle above. This allows for precise positioning of the substrates in relation to the spindle's motion, ensuring accurate and repeatable processing results. Finally, the control module serves as the brains of the machine, and allows for automated control of the spindle and workstation parameters. It can be programmed to accurately and repeatedly execute up to 12 complex, multi-directional grinding, lapping, and polishing processes. This allows for quick setup and execution of various fabrication processes. Additionally, the control module includes a graphical user interface, which allows operators to easily adjust parameters as desired. Overall, BUEHLER Fibropol 3000 is an advanced machine that can rapidly and accurately fabricate substrates with minimal defects. Its combination of advanced components, such as the spindle, workstation, and control module, allow for precise manipulations and execution of grinding, lapping, and polishing processes.