Used BUEHLER MetaServ 250 #9220001 for sale

BUEHLER MetaServ 250 is a full-featured wafer grinding, lapping and polishing equipment designed for advanced material science applications. MetaServ 250 is the only system on the market dedicated to this advanced technology, and it boasts several unique features which make it an invaluable addition to any laboratory. The hardware of BUEHLER MetaServ 250 is headlined by its dual-reciprocating head-motion drive unit and high-speed spindle motor, both of which are electronically controlled for accuracy and safety. Heavy-duty cast aluminum and steel construction makes the grinding surface as robust and as rigid as possible, guaranteeing consistent, reliable results. To facilitate optimal material removal, MetaServ 250 offers a plethora of grinding and lapping wheel options, as well as optimized tool holders for the most common sizes. With variable speed controls, it can handle a wide range of grinding and polishing needs, from a few angstroms to over five hundred nanometers. For precise part positioning, BUEHLER MetaServ 250 utilizes advanced servo controls along with optical and contact sensing, allowing for repeatable accuracy to within 0.25 micron. It can also be adjusted to handle wafers up to eight inches in diameter, and can be set up to grind both delicate supplies or harder materials. For operators, MetaServ 250 partners a touch-screen control panel with a specially designed OESs control machine, providing an intuitive and powerful interface to manage all aspects of grinding, lapping and polishing. A configurable safety control tool is also integrated, ensuring that unexpected power losses or overloads don't lead to dangerous issues. Overall, BUEHLER MetaServ 250 is an advanced wafer grinding, lapping and polishing asset that is perfect for any laboratory requiring advanced precision and repeatability. Its robust construction, wide range of capabilities and intuitive control model make it an ideal tool for any material science application.