Used BUEHLER MetaServ 250 #9265632 for sale

BUEHLER MetaServ 250 is a wafer grinding, lapping and polishing equipment providing the ultimate combination of versatility and precision. The system is specifically designed to process small- to medium-sized semiconductor wafers up to a diameter of 250mm. The slurry unit integrated into MetaServ 250 allows for precise control of the wafer grinding process, which results in the rapid removal of surface defects, and creates a highly uniform and polished finish. The machine is often used in applications such as epitaxial processing, defect repair, and back-side grinding. It is virtually maintenance-free, as it does not require frequent servicing, and its advanced controller software helps to ensure repeatable results. BUEHLER MetaServ 250 also features automated process monitoring and slow motion grinding for enhanced control over the polishing process. The tool is equipped with innovative dual-head and single-head grinding modules, which can be used to achieve various levels of roughness and clarity on the wafer surface. The asset can easily handle a range of materials, including silicon-based wafers, hard quartz substrates, and challenging ceramic materials. MetaServ 250 provides high repeatability even on complicated wafer geometries, ensuring consistent performance on each production run. This model also provides a wide range of speed, pressure, and temperature control options for grinding and polishing tasks, allowing the user to fine-tune the process for a desired result. Additionally, its intuitive user interface allows for easy programming of the equipment for specific protocols and application-specific requirements. Overall, BUEHLER MetaServ 250 is a complete wafer grinding, lapping, and polishing system and one of the best options for superior surface finish in the semiconductor industry. Its robust construction, automated process monitor, and wide variety of grinding and polishing options make it an ideal solution for a wide range of silicon-based wafer processing applications.