Used BUEHLER MetaServ 3000 #9096746 for sale

ID: 9096746
Polisher.
BUEHLER MetaServ 3000 is a wafer grinding, lapping and polishing equipment designed to provide superior performance and quality for the preparation of semiconductor substrates. This machine is made by BUEHLER, a leader in microscopy and material testing solutions for over 80 years. MetaServ 3000 is a compact, user-friendly, tabletop system that can be used for backgrinding, grinding, lapping, and polishing of semiconductor wafers ranging from 4″ to 150mm. This unit features the latest, most innovative technologies to ensure fast and accurate preparation of semiconductor substrates with high-level surface quality. The machine is equipped with a state-of-the-art grinding wheel, featuring a 72-grit, diamond, and aluminum oxide material to ensure excellent results every time. This tool also boasts an advanced lapping and polishing asset that can produce a superior finish on both thin and thick wafers. BUEHLER MetaServ 3000 also offers automatic wafer tracking to monitor and record wafer movements as part of the process for increased accuracy and precision. In addition, the model features an intuitive user interface and a wide range of control features. This includes a calibration software package to quickly and easily select and manage grinding, lapping, and polishing parameters. You can also adjust the process times and variables to create unique finishes for specific applications. MetaServ 3000 provides superior performance with low power consumption and is also highly reliable thanks to its robust design and durable components. It can deliver superior results when used for wafer deburring, wafer bridging, radius correction, and other applications. Furthermore, the equipment can be integrated with other BUEHLER equipment to maximize efficiency and accuracy. Overall, BUEHLER MetaServ 3000 is an exceptional wafer grinding, lapping, and polishing system that can provide superior performance for preparing semiconductor substrates. Its intuitive user interface, advanced grinding wheel, and highly customizable settings make it an excellent choice for a wide range of applications. It is an ideal solution for any organization that requires highly accurate and reliable solutions for preparing substrates.
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