Used BUEHLER Metlap 40-1700 #9033157 for sale

BUEHLER Metlap 40-1700 is an advanced semi-automatic wafer grinding, lapping and polishing system. The 40-1700 is designed to provide high precision, high performance, and high throughput, while requiring minimal labor for operation. It is suitable for a variety of applications, such as substrate thinning and polishing, stress relieving, interfacial preparation and grinding, and planarization of substrates. Metlap 40-1700 is composed of four main components: a wafer grinder, a lapping table, a polishing table, and a controller. The wafer grinder is a 1.7m x 1.7m precision grinding table designed for grinding operations on both sides of the wafer. It is equipped with a variety of grinding and polishing applications including dicing and polishing, scratch removal, and corner rounding. The lapping table is a 600mm x 500mm lapping plate designed to accurately lap and polish complex surfaces. It allows for precise control of lapping speed and aggressiveness to achieve desired polishing results. The polishing table is a 800mm x 500mm polishing table designed for dry polishing and wet polishing operations. It comes with a variety of polishing discs and scrubbers, as well as numerous configuration options. The controller is a microprocessor-based unit designed to automate and control all components. It features a touchscreen interface, allowing for precise control of process parameters and a number of process sequences. In addition to its basic components, BUEHLER Metlap 40-1700 comes with a host of additional accessories. It supports various grinding and polishing media including diamond, ceria, lapping film, and colloidal silica. It features a variety of sample holders for varied substrate sizes and configurations. It supports a range of diamond abrasive wheels, as well as different cleaning accessories for removal of particles and detergents for surface cleaning. Last but not least, it comes with a range of safety features, including an isolator to keep out contaminants and a secondary safety shield to protect the operator from heat and sparks. Metlap 40-1700 is an advanced, semi-automatic grinding, lapping and polishing system capable of meeting the needs of a variety of sample preparation and processing applications. It is designed to be easy to use, reliable, and safe, providing users with a high quality, cost-effective solution for their needs.