Used BUEHLER Minimet 1000 #9103716 for sale

BUEHLER Minimet 1000
ID: 9103716
Grinder.
BUEHLER Minimet 1000 is an innovative wafer grinding, lapping, and polishing equipment. This system offers an ideal combination of accuracy and precision, as well as repeatability, along with a host of functional design features for ease of use and dependability. This unit has a robust and compact design, perfect for use in numerous different operations, and is engineered to provide repeatable and dependable results. The machine is composed of a base tool consisting of a granite base, a 1 HP drive motor and a variable speed control, plus a 15-inch precision-ground table. Minimet 1000 offers an extensive range of grinding, lapping and polishing capabilities. The asset includes a range of diamond and silicon carbide abrasive discs designed to take advantage of standard 4-inch and 6-inch diameter wafer axes. In addition, a variable-speed rotating polishing buff is available for use with the polishing parameters. This ensures consistently smooth and uniform surfaces with minimal variations in the grinding and polishing process. BUEHLER Minimet 1000 also offers advanced features that provide maximum control and flexibility. An automated speed-control model allows for precise control of the grinding and polishing process. The entire process is also monitored through the intuitive user interface, providing real-time feedback and data such as RPM, pressure, heat, and water flow. This allows users to adjust the process and maximize performance. In addition, the equipment is designed for maximum safety. Safety controls help prevent injury from grinders and polishers. A low-level grinding guard ensures safety when grinding wafers, while a variable speed, start-up-preventing switch prevents accidental start. Minimet 1000 is the perfect combination of robust design and features for those needing accurate, repeatable results. This system offers total accuracy, flexibility, flexibility, optimal safety and it can be used for a wide variety of wafer grinding, lapping, and polishing operations.
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