Used BUEHLER Minimet #9164074 for sale

BUEHLER Minimet is a wafer grinding, lapping & polishing system designed for use in semiconductor processing. It is perfect for thin-film applications, such as surface preparation of silicon wafers and other substrates. The system uses a combination of diamond grinding, lapping and polishing to produce a pristine finish on small parts. Minimet process begins with loading the part onto BUEHLER grinding/polishing abrasive wheel. This abrasive wheel is constructed of a variety of metal or polyurethane materials, depending on the required finish. The wheel is then mounted on the 6-axis machine and moved across the part, grinding away the surface. This process is repeated until the desired finish is achieved. Once the grinding stage is complete, the lapping process is employed. The part is placed on the lapping surface and moved across the face of the material while being sprayed with a lapping agent. This agent, usually a diamond grit, engages with the surface of the part and grinds out small surface imperfections. By gradually increasing the size of the lapping area, larger surface imperfections can be removed. Finally, the polishing phase is used to bring the surface to a high-gloss finish. The part is mounted on the polishing wheel and covered with a polishing pad. This pad, with the help of a polishing agent, smooths out the surface while bringing it to a mirror-like finish. The versatility of BUEHLER Minimet system makes it an ideal choice for a wide variety of die and semiconductor processing. Its ability to produce a pristine finish on small parts makes it invaluable to the semiconductor industry. The combination of diamond grinding, lapping, and polishing allows for a uniform finish which is essential to producing quality components. This makes Minimet a dependable choice for creating successful parts.