Used BUEHLER PETRO-THIN 38-1450-160 #9291561 for sale

BUEHLER PETRO-THIN 38-1450-160 is a wafer grinding, lapping & polishing equipment designed to produce very high quality flat and parallel surfaces on hard materials such as wafers, ceramics, metals, and compound semiconductors. This system can process substrates up to 150 mm in diameter and up to 8 mm thick. The core of the unit is the 12″ HV Platen, which is used to provide a highly stable grinding and polishing platform. The HV Platen is driven by a set of two direct drive servo motors providing a uniform grinding and polishing surface. The platen also allows for a micro-positioning device to make sure the entire polishing surface is flat and parallel. The PETRO-THIN 38-1450-160 comes with a 3-axis feed mechanism, which is used to drive the wafer in the desired direction during the grinding and polishing processes. This allows for precise wafer alignment and process repeatability. For precise control of polishing parameters, the machine is equipped with an automatic controller. This controller allows the user to adjust the grinding/polishing pressure, polishing speed, platen rotation, current, time, and grinder grit size. This controller is also equipped with a hardness tester which can be used to accurately measure wafer hardness and determines the best polishing parameters. The tool also features advanced top-down wafer grinding/polishing technology which reduces wafer warping and ensures flat and parallel surface results. The PETRO-THIN BUEHLER PETRO-THIN 38-1450-160 also has an integrated feedback asset that monitors the grinding pressure and temperature in order to maintain optimal grinding conditions and quality results. In order to maintain a clean and controlled environment, the model comes with an LCD display with a real-time video monitoring equipment and air filtration unit for filtering dust particles from the air before it reaches the wafer. This helps to reduce potential contamination and optimize wafer surface results. 38-1450-160 is an ideal tool for high-precision grinding and polishing of wafers, ceramics, metals, and compound semiconductors in a production environment. It is an efficient and cost-effective solution for wafer grinding, lapping, and polishing.