Used BUEHLER Phoenix 4000 #177485 for sale

BUEHLER Phoenix 4000 is an advanced, automated wafer grinding, lapping and polishing equipment designed for maximum throughput and process fidelity for the application of wafer fabrication and thin film deposition. The system removes semiconductor defects from the raw wafer surface to ensure high yield repeatability for critical dimension uniformity and wafer planarity. Phoenix 4000 utilizes a three-stage process consisting of grinding, lapping and polishing. During the grinding phase, the automated unit uses elastomer belts to quickly and accurately remove material from the wafer, while the lapping phase uses diamond compound and abrasive paper to achieve a smooth, uniform finish on the wafer surface. The last phase of the process, polishing, is then used to achieve a very low Ra (roughness average) on the wafer surface and achieve the required thin film deposition. BUEHLER Phoenix 4000 also features a wide variety of cutting-edge safety features, including a total enclosure to protect against dust particles and an adjustable force sensor that monitors the pressure being applied to the wafer throughout the polishing process. Additionally, it has an automated wafer protection machine to prevent over grinding and an LCD monitor display for complete process control. In summation, Phoenix 4000 is a highly advanced and automated wafer grinding, lapping and polishing tool designed for maximal throughput and process fidelity for the application of wafer fabrication and thin film deposition. It has a number of safety features and process controls as well as a wide variety of elastomer belts and diamond compound for accuracy and repeatability.