Used BUEHLER Phoenix Alpha #150153 for sale

BUEHLER Phoenix Alpha is a state-of-the-art automated wafer grinding, lapping, and polishing equipment. It combines three technologies in a single platform and enables high throughput, high productivity and excellent control of surface finish. It utilizes a computer-controlled axis system for accurate material positioning and pressure control on the lapping and polishing stages to ensure a consistent and repeatable finish. Phoenix Alpha offers superior grinding performance and can be used to precisely process wafers from 15 mm to 300 mm in diameter. At the heart of BUEHLER Phoenix Alpha is a 400 mm lapping plate that can accommodate most types of die materials. The plate is driven by the unit's powerful electric motor and is designed to provide a consistent pressure across the wafer material. The lapping plate is adjustable in both inclination and pressure to optimize surface finish. Phoenix Alpha also features programmable motion of its grinding machine, allowing it to precisely manage the grinding process across a range of stone sizes and rigidity. BUEHLER Phoenix Alpha is also equipped with a wet-station, allowing grinding and polishing of wafers without the need for traditional grinding abrasives or polishing chemical. The wet-station boasts advanced filtering, pumping, and auto-clean functions to ensure efficient and ongoing operation. In addition, Phoenix Alpha features a water cooling tool that reduces temperature gradients and ensures optimal surface quality. BUEHLER Phoenix Alpha also offers advanced process monitoring and control, allowing process parameters to be adjusted to ensure an optimal chemical balance across the wafer surface. The advanced monitoring technology allows for data logging and analysis of surface finish, distortion, and other important parameters which can be used for troubleshooting and to ensure optimal performance. Overall, Phoenix Alpha is a superior automated wafer grinding, lapping, and polishing asset which offers the capability of obtaining consistent and repeatable finishes of the highest quality. It combines the best-in-class grinding and polishing technologies to deliver cost-effective processing of wafers up to 300 mm in diameter with superior levels of accuracy and control.