Used BUEHLER Phoenix BETA #9288501 for sale

BUEHLER Phoenix BETA is a wafer grinding, lapping and polishing equipment developed for use in the semiconductor industry. The system features an advanced three-axis motion and vibration control unit supported by a large area horizontal granite table. It is engineered to enable precise, automated control of wafer thickness and surface roughness. The machine utilizes a high-power motor with adjustable frequency capability to drive a belt-feed tool that rapidly grinds, laps and polishes wafer surfaces. It also employs the use of programmable CNC control inputs to adjust the feed rate and depth-of-cut for desired process results. The unit is also capable of executing polar and non-polar grinding when equipped with a second abrasive belt kit. A built-in grinding and lapping head with 6-axis motion provides adjustable power to the grinding wheel and rotational speed. Depending on the application, the operator can adjust the power and speed of the abrasive belt by selecting from a range of parameters. Wafer cleaning is also a feature on the asset, allowing for the removal of residue after processing. Phoenix BETA wafer grinding, lapping and polishing model is designed to deliver top-of-the-line quality for a range of applications. It's quick and simple adjustment mechanism allows for maximum efficiency as well as flexibility. The equipment also boasts a variety of features such as automatic rubbing control, automatic compensation for wafer differences and an intuitive user interface that makes setting up and controlling the system easy. In short, BUEHLER Phoenix BETA offers an ideal solution for manufacturers who require precision and accuracy when grinding, lapping and polishing wafers. It is the ultimate tool for high-volume, high-precision operations and large-area processes. The unit sets a new standard for wafer grinding, lapping and polishing, and is designed to provide the highest quality results demanded by the semiconductor industry.