Used BUEHLER PowerPro 400 #9087028 for sale

BUEHLER PowerPro 400 is an advanced wafer grinding, lapping and polishing equipment customized for silicon wafer applications. This easy-to-operate system is specifically designed for edge grinding, lapping and polishing of complex fabricated multi-level and thin wafers. PowerPro 400 unit includes a precision air-bearing spindle for fine grinding with excellent process control and repeatability, a precision polishing plate for larger area polishing and lapping, and state-of-the-art vacuum technology for superior wafer handling and lapping capabilities. The air-bearing spindle is designed for precise positioning of the wafer grinding head, which allows for a uniform grinding operation. The multiple-level and side grinding protection ensures precise, reliable and safe operation. The adjustable work table is designed to accommodate both thin and thicker wafers, providing accurate and repeatable polishing and lapping of large size wafers. The precision polishing plate utilizes a rotational motion along with a belt driven counter-rotating mass to achieve a uniform polishing surface. This allows for even grinding of complex shapes and delicate edges. The advanced vacuum technology eliminates bubbles from the grinding and polishing process and makes wafer handling smooth and easy during the lapping step. In addition to the automated operation of BUEHLER PowerPro 400, the user interface allows for manual settings to be adjusted for optimized wafer processing and edge profile. Furthermore, the machine offers precise adjustment of the lapping and polishing variables to ensure high quality results. In conclusion, PowerPro 400 is an advanced, easy-to-operate tool specifically designed for advanced wafer grinding, lapping and polishing applications. The asset features an air-bearing spindle for fine grinding, a precision polishing plate for larger area polishing and lapping, and vacuum technology for superior wafer handling and lapping. BUEHLER PowerPro 400 model features precise process control and repeatability for optimized wafer processing and edge profile.