Used BUEHLER Techmet III #9167190 for sale

BUEHLER Techmet III is an advanced wafer grinding, lapping and polishing equipment. The system incorporates state-of-the-art technology to create precise wafers with extremely fine surface finishes and best topography. The unit consists of a powerful and stable grinding/polishing spindle, the latest high-tech polishing machine, and a variety of accessories. The high-torque, direct-driven grinding/polishing spindle uses air cooling technology and features an advanced high-precision bearing machine. This ensures precise and uniform grinding and polishing of even the most complex surfaces. The motor operates at up to 4,000 rpm and can reach a maximum torque of 50 Nm. It is suitable for a variety of abrasives and substrate materials. Techmet III polishing machine is capable of producing highly precise results. It consists of a double-sided 16-inch platen, which is driven by a low-maintenance, direct-drive motor. The platen works in conjunction with up to three adjustable polishing heads, each with variable speed and variable force capability. The tool is also equipped with an Automatic Control Beam, offering precisions monitoring of the grinding and polishing process. In addition to the features already mentioned, BUEHLER Techmet III includes a variety of additional accessories. These include a central head log disk for wafer loading, a cooling water manifold with control, a SuperPad abrasive cutting asset, and an auto-dress abrasive model. Overall, Techmet III is an ideal wafer grinding, lapping and polishing equipment for semiconductor and optoelectronics manufacturers that need to produce high quality wafers with extremely fine surface finishes and precise topography. It offers a robust grinding/polishing spindle with powerful torque, an advanced polishing machine, and a variety of accessories for precise and consistent wafer processing.