Used BUEHLER Vibromet 2 #293639032 for sale

BUEHLER Vibromet 2 is a wafer back grinding, lapping, and polishing equipment designed to provide high performance wafer back grinding for advanced semiconductor substrates. The system utilizes a five-axis, robotic arm design for fast and accurate wafer handling and positioning. With its operating and performance characteristics, the unit is ideal for advanced device fabrication and quality assurance in the growing semiconductor industry. The machine includes a spindle housing which supports a robotic arm assembly, a feed wheel angle control, and a lapping/polishing platens. A tool holder is connected to the spindle and is used to hold both grinding wheel and/or lapping/polishing platens. A load tool is used to lower and raise the platen position relative to the spindle. The asset is designed to provide high-acceleration and run-out tolerances and repeatable operation. Vibromet 2 model uses a novel triple-axis robotic arm assembly to quickly and accurately move the loaded platens to the grinding wheel or platen. The triple-axis equipment enables precision positioning of the wafer relative to the grinding or polishing surface. The feed wheel angle control allows the robotic arm to precisely control the angle of the grinding wheel and/or lapping/polishing platens to ensure ideal surface contact during grinding and/or polishing. The system's high-performance grinding wheel is designed to provide excellent surface removal rate, speed, and finish. The grinding wheel is capable of handling wafers up to 12" in size and is capable of 0.01 micron resolution repeatability. The grinding wheel is equipped with a pressure-sensing feedback unit for controlling both the feed and speed of the wheel. The lapping/polishing platens are also capable of providing superior surface performance, with a uniform finish from edge to edge. BUEHLER Vibromet 2 machine includes an intuitive control panel, providing users with full control over the process parameters. The tool is also equipped with an advanced process monitoring asset to ensure quality and reliability. The model's performance is further enhanced by an energy monitoring equipment and predictive maintenance features. Overall, Vibromet 2 is an advanced wafer back grinding, lapping, and polishing solution designed to provide fast and accurate wafer handling, as well as superior performance. The system is designed to provide excellent surface finish and speed, enabling advanced device fabrication and quality control within the semiconductor industry.