Used BUEHLER Vibromet #293627399 for sale

BUEHLER Vibromet
ID: 293627399
Vibratory polisher Power supply: 500 V.
BUEHLER Vibromet is a sophisticated equipment designed to offer professional grinding, lapping, and polishing of wafers. It is equipped with powerful vibration motors and velocity control that allow for precise manipulation of various parameters, such as the grinding and lapping speed. A wide range of grinding, lapping and polishing tools can be used with the system, providing users with a great degree of flexibility. The unit also allows for the monitoring of the grinding and lapping process, so that any adjustments can be made to ensure a consistent and efficient workflow. Vibromet has a modern control interface that simplifies the user experience. This interface allows the user to easily set up and monitor the grinding and lapping process. Additionally, the user is able to access a variety of assists and alarms that allow for instant adjustment of the process if needed. A wide range of accessories can be integrated into the machine, allowing it to be adapted to a variety of wafer sizes. The grinding and lapping process performed by BUEHLER Vibromet is done using diamond abrasives and a flexible cloth back grinding belt. This belt provides a smooth finishing surface and helps to prevent cross-contamination of the wafer from other parts of the tool. The vibration motors work to reduce the cutting forces and provide a level of controllability. The polishing process involves the use of diamond abrasives and an integrated diamond polishing pad. This allows for an even and consistent finish across the whole wafer, regardless of its size. The integrated diamond polishing pad also helps to significantly decrease the wear and tear on the grinder, and it is capable of giving a mirror finish to the wafer in a matter of minutes. Overall, Vibromet is designed to offer a versatile and reliable method for grinding, lapping, and polishing wafers. Its modern control interface and flexible accessories allow it to be adapted to a variety of wafer sizes, while its powerful vibration motors and integrated diamond polishing pad help to provide an efficient and consistent finish.
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