Used BULA BM 365 #9195106 for sale

BULA BM 365 is a high precision, automated wafer grinding, lapping and polishing equipment that offers superior machining accuracy and performance in a variety of materials. This system comes standard with a two-axis CNC controller for quick and accurate control, a powerful spindle for precise grinding and lapping, and an automated wafer dispense unit. BM 365 is designed to grind and lap semiconductor wafers up to six inches in diameter. The spindle is equipped with an adjustable speed range of 0 to 2,500 RPM, providing accurate grinding results. This machine has a maximum spindle power of 1.5KW to handle even the toughest materials. The tool is also equipped with a pneumatic roller clamp, ensuring the precise positioning of the wafer, improving machining accuracy. The lapping and polishing process is performed using diamond abrasive media. The high speed of the spindle allows for short cycle times and superior abrading quality. An op-top lapping plate ensures uniform rotation and automatic lapping pressure control for superior grinding results. The asset is also equipped with a vacuum model to insure efficient material removal and accurate lapping of the wafer. BULA BM 365 includes two stations for automated wafer loading and unloading. The equipment is also equipped with a fully automated wafer dispense system to significantly reduce cycle times. The wafer dispense unit is capable of operating in either vacuum or nitrogen-free mode, depending on the requirements of the process. BM 365 is compatible with computer software packages for maximum flexibility. It features an Ethernet interface for easy remote connection and data exchange. The intuitive and interactive human-machine interface of the machine makes setup and operation fast and easy. BULA BM 365 provides superior precision and accuracy for grinding, lapping and polishing with a wide variety of materials. With its features and performance, the tool is sure to help achieve greater yields and reduce costs.