Used BURLINGTON SS-52X103WP #178854 for sale

BURLINGTON SS-52X103WP is a wafer grinding, lapping and polishing equipment engineered to perform a wide range of flat and contoured surface processing applications. It is the perfect choice for chip fabrication and preparation, semiconductor production, thin-film photovoltaic cell manufacturing, and other thin-film optical device manufacturing operations. The system is comprised of a high production-volume grinding stage, a series of three or more lapping/polishing plates, and optional polishing/semifinishing configurations. Its modular design allows for fast and effortless tool changing and provides specialized capabilities for grinding, lapping and polishing plenty of different materials. The unit includes powerful drive motors that outperform industry standard positioning size, in combination with the robust construction of the slide assembly and the rigid base provide maximum tool engagement and accurate process control. SS-52X103WP also features a low-profile, heavy-duty adjustable grinder machine. The adjustable height and angle options of the grinding arms creates flexibility for use in various applications. Its die-pack construction allows for easy adjustment of the drive tool resulting in easy and efficient chip production. Additionally, the side plates are adjustable so the grinding and polishing surfaces can be adjusted to the desired angle and processes. In addition to its grinding, lapping and polishing capabilities, BURLINGTON SS-52X103WP offers various other features that enhance its functionality and precision. For example, it features an array of brushless motors and servos for both grinding and polishing speed optimization. Furthermore, its integrated touchscreen interface allows for easy navigation and control, as it simplifies programming and QuickSet up processes. This permits users to adjust and control the processing parameters of each wafer, while also providing high-resolution process monitoring. Finally, the asset can be fully integrated with its analysis instruments to generate comprehensive data analytics and results. This powerful combination of capabilities provides a truly powerful production solution for a range of precise wafer applications. For an important upgrade, the cooling model is also available as an add-on, thus allowing users to achieve increased durability while minimizing the amount of thermal drift. In conclusion, SS-52X103WP is a reliable, high-performance wafer grinding, lapping and polishing equipment. It provides the perfect combination of precise, advanced grinding, lapping and polishing technologies, integrated features and instruments for precise process control and comprehensive data analytics. These features make it a top choice for operations that require precision wafer processing.