Used CCCP 5К822В #9261971 for sale

CCCP 5К822В is a versatile wafer grinding, lapping & polishing equipment. The system is designed for the precise processing of wafers with a wide variety of diameters. The unit is composed of three parts—the grinding wheel, the lapping wheel, and the polishing wheel. The grinding wheel has an adjustable spindle and is driven by an AC motor with variable speed. To ensure a precise surface finish, the wheel moves in both longitudinal and transverse directions. The grinding wheel is composed of diamond particles bonded to a stainless steel substrate. The diamond particles are arranged in a spiraled pattern that allows for high-performance grinding of most materials. The lapping wheel is designed to add a precise, consistent finish to the surface of the wafer. It utilizes an abrasive mineral substrate and an adjustable speed spindle to achieve the desired results. It is composed of either a stainless steel mesh mesh wheel or a polishing wheel with a silicone coating. The polishing wheel is designed to remove any remaining imperfections and to provide a flawless surface finish. It utilizes a silicone polishing screen that ensures consistent results and has an adjustable speed spindle. The polishing wheel is composed of either polycrystalline diamond particle, silicon carbide and a polyurethane sealant. 5К822В is a truly unique and versatile unit for the precise processing of wafers with a wide range of diameters. The combination of the grinding wheel, lapping wheel, and polishing wheel provides a precise, consistent finish each and every time. The adjustable speed spindles and the use of diamond, silicon carbide, and polyurethane sealants ensure a perfect surface finish with fewer imperfections. The machine is ideal for any application that requires precise fineness, accuracy, and surface finish.