Used CHEVALIER FSG-1632AD #9223049 for sale

CHEVALIER FSG-1632AD is an efficient and compact wafer grinding, lapping, and polishing equipment designed for the semiconductor industry. Its powerful grinding spindle offers high-precision surface finishes and flatness in a wide range of workpiece materials. It features a range of variable-speed workstations, enabling users to finely fine-tune the automation process. The large, adjustable diamond grinding wheel offers fast, precise, and repeatable results. Additionally, its automatic computer disk management ensures accurate, safe, and reliable operation when dealing with fragile wafers. FSG-1632AD features an easy-to-use and robust control panel with a 10-inch LCD touch screen monitor, providing users with quick and precise control of all grinding processes. With its high-performance real-time control, users can operate the grinding spindle with ease. Moreover, its spindle speed is adjustable up to 6,500 RPM and axes acceleration up to 0.1 G. The standard configuration includes two 3-in-1 wafer grinding and lapping tools which provide reliable, repeatable high-precision results and improve production efficiency. To ensure high-precision results, the system is equipped with a vacuum wafer holder that securely holds wafers in place for grinding and lapping operations without clamping. Additionally, the tension wheel positioner adjusts the grinding surface's plane of incidence, thereby increasing extraction precision. The unit supports various grinding and lapping setups, including three-dimensional grinding, tape grinding, pad grinding, and flexible polishing. Overall, CHEVALIER FSG-1632AD is an ideal wafer grinding, lapping, and polishing machine for the semiconductor industry. It incorporates a range of advanced features and user-friendly design that ensures accurate, reliable, and repeatable results as well as high production efficiency. It is ideal for use in the research and development of a wide range of wafer and device types.