Used CHEVALIER FSG-1640AD #9101583 for sale

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ID: 9101583
Automatic surface grinder Table Size: 16" x 40" Longitudinal Table Travel: 43" Cross Saddle Travel: 18" Distance from Spindle Center to Table: 24.375" Table Speed (Variable): 16 FPM - 82 FPM Cross Feed (Intermittent): .125 IPM - 1.25 IPM Automatic Downfeed Rate: .00005 IPM - .002 IPM Rapid Traverse: 8 IPM Grinding Wheel Size: 14" x 2" x 5" Includes: 3-Axis Power with Incremental Down Feed 16" x 40" Electromagnetic Chuck 5 HP Spindle Motor Wheel Dresser.
CHEVALIER FSG-1640AD is a top-of-the-line wafer grinding, lapping and polishing equipment for precision machining. It is designed for complex wafer grinding and polishing operations in ultra-precision semiconductor device manufacturing. FSG-1640AD utilizes an independently powered grinding wheel spindle, adjustable vertical head stroke, and adjustable speed of the wheel. It can grind, lap, and polish a wide variety of wafer materials, including stainless steel, silicon carbide, ceramic, and other ferrous and non-ferrous materials. CHEVALIER FSG-1640AD features an automatic interface with CNC and manual controls, a touch screen user interface, and a variety of grinding and polishing options. The grinding wheel spindle is run by a variable-frequency drive which offers speeds of up to 1000 RPMs. It is capable of producing parts with exceptional surface finish and contour accuracy. The adjustable vertical head stroke allows the user to precisely control the depth of grinding. FSG-1640AD is equipped with a complete tool-holding system and an automatic load/unload mechanism that allows for quick changeovers. Its PLC-based automation control unit and motion control make it easy to program and operate. CHEVALIER FSG-1640AD is a powerful and precise tool for advanced wafer grinding, lapping and polishing. Its various features and advanced tool-holding machine make it perfect for achieving superior quality and accuracy in ultra-precision machining. It is an excellent choice for processing stainless steel, silicon carbide, ceramic, and other ferrous and non-ferrous materials, and for high-precision polishing operations.
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