Used CHEVALIER FSG-618M #170025 for sale

CHEVALIER FSG-618M Wafer Grinding, Lapping & Polishing Equipment is a state-of-the-art, multi-function fabrication machine for the production and processing of optical communication components. It is designed for high accuracy grinding, lapping, and polishing operations of wafers, optical components, and other precision surfaces. It features an enclosed overhead safety housing for hazardous dust, and a one-piece cast base for machine stability. FSG-618M Waffle Grinding system is equipped with a special diamond abrasive grinding wheel and a wide variety of grinding wheels, lapping plates and polishing pads. The grinding wheel is designed to provide extremely accurate surface finishes, while the wide variety of lapping and polishing pads enables perfect surface finishes on a variety of wafer materials. The lapping and polishing plates are available in various sizes, shapes and materials such as aluminum, nickel and stainless steel. The machine also features a plate holder that can be adjusted to achieve accuracy on small and large diameter surfaces. The unit is powered by a motor and equipped with an unique inverter/servo drive machine that enables precise and repeatable movements for grinding and polishing operations. The inverter/servo drive tool also includes high precision digital encoders for precise positioning and monitoring of the grinding wheel, and an electronic pressure sensor for optimal process control. CHEVALIER FSG-618M has two grinding wheels, one for rough grinding and another for polishing. Both grinding wheels are adjustable and provide a variety of flat or angle grinding profiles. The machine also features a conveniently located air blower for cooling, and a professional coolant is used for the grinding process. To ensure the highest accuracy, FSG-618M is fitted with a user-friendly touch-screen LCD display panel, which allows the user to easily configure the grinding and polishing parameters. The device also features an adjustable vacuum asset and a power failure protection model. Furthermore, the machine offers various accessories such as an automatic tool changer, automated vertical alignment equipment and a wafer pressure adjustment system. Overall, CHEVALIER FSG-618M Wafer Grinding, Lapping & Polishing Unit is a versatile, high-precision fabrication machine that ensures maximum efficiency and accuracy in the fabrication of optical communication components. From grinding to lapping and polishing, the machine allows for precise, repeatable, and cost-effective production of a variety of optical components.