Used CHEVALIER FSG-618M #9160588 for sale

CHEVALIER FSG-618M wafer grinding, lapping, and polishing equipment is a highly advanced and accurate tabletop processing system. It can be used to process a wide range of semiconductor wafers including silicon, quartz, sapphire, and other materials. It is engineered to provide highly accurate results with tolerance of less than 0.2 microns, making it an optimal choice for critical surface finishing and polishing operations. The machine is driven by a highly powerful yet eco-friendly spindle motor which provides all the necessary speed and torque for the grinding, lapping, and polishing processes. It runs on direct drive technology resulting in fast response and low noise operation. It is equipped with a PC-based control unit which allows for intuitive and easy operation. It is also designed to be energy-efficient and compliant with latest safety regulations. The polishing mechanism contains high-precision components which enable grating or lapping of substrates/items to produce high finish on the surface. It has a 6" diamond disk for use in various applications such as grind-off, backside lapping, and polishing. Additionally, abrasive wheels can also be used with the grinding attachment for more challenging projects. For finishing operations, FSG-618M features a high-precision belt-and-roller contact machine to polish the ground or lapped surfaces in a uniform manner. This tool includes both manual profile-adjustment and digital control. The asset also offers water-jet cooling for operations on hard materials and a vacuum blower for debris collection. The machine is also designed for energy efficiency, which is achieved through the use of a variable CCM (Constant-Current-Meter) control model. This equipment efficiently regulates the current for the motor and other components, so only the necessary energy is used when needed. In summary, CHEVALIER FSG-618M wafer grinding, lapping, and polishing system provides the most advanced technology and efficient operations for precision finishing operations. The machine is equipped with the necessary tools and features to produce uniformly and accurately finished semiconductor wafers. Its efficient energy-saving characteristics and safety features make it an ideal choice for critical wafer processing operations.