Used CHEVALIER FSG-618M #9209177 for sale

ID: 9209177
Grinding machine (2) HP Aisle: 06B Bay: 2100 Power: 3 Phase / 60 Hz Voltage: 230 / 460.
CHEVALIER FSG-618M is an advanced wafer grinding, lapping and polishing machine used for the generation of ultra-smooth surfaces on semiconductor wafers. It is designed for high-precision, high-speed grinding and lapping and polishing of the silicon wafer surfaces. FSG-618M is ideal for operations that require tight control of surface texture and dimensional accuracy. CHEVALIER FSG-618M comes equipped with a high-precision grinding spindle powered by an ultra-quiet frequency-control equipment. This provides smooth and steady speed control and delivers superior machining accuracy, surface finish, and dimensional accuracy. It also features an automatic feed system, which allows precise control of the grinding pressure and depth, enabling high-precision grinding on thick and thin wafers. The machine has a user-friendly touch screen control panel, allowing easy operation and programming of the start/stop, feed, speed, and other parameters. The unit also comes with multiple programmable working units, enabling the user to set up different grinding, lapping and polishing operations and store settings for repeated use. FSG-618M is built with advanced safety features including an emergency stop machine and a heavy-duty protective cover to protect the operator against any potential hazards caused by accidents or improper handling. It also comes with an advanced vacuum tool for dust and chip management, ensuring that no debris is discharged into the environment. CHEVALIER FSG-618M is an advanced, reliable, and highly accurate wafer grinding, lapping and polishing asset. It is designed for maximum efficiency, precision, and production, providing high-quality and efficient surface finishes for semiconductor wafers and other wafer-type components.
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