Used CHEVALIER FSG-B818 #158246 for sale

CHEVALIER FSG-B818 grinding, lapping and polishing equipment is a reliable and precise wafer processing system designed to meet the demands of semiconductor and optoelectronic industries. This unit combines precision automation and high-precision load control with a worktable to handle high-workload duplex grinding processes. FSG-B818 machine is equipped with a loading tool, vibration isolation table, dual-head grinding and lapping spindle, and enclosed dust collection. The loading asset is designed to increase throughput and minimize vibration by accurately orienting wafers and positioning them on the appropriate grinding/lapping centers. The vibration isolation table is incorporated to ensure that even large wafers retain workholding accuracy during grinding. The dual-head grinding and lapping spindle module is designed for a flexible machine setup, allowing the model to cater for a variety of workpiece sizes. In addition to grinding and lapping, polishing can also be done with an optional polishing tool. The equipment is calibrated by laser so that the degree of flatness is adjustable and can be within the 0.1μm. Moreover, the system is also equipped with an integrated dust collection unit to prevent damage to materials due to airborne particles. This dust collector is equipped with two filter units, one main mesh filter, and one fine mesh filter, with capacity of over 120 m³/hour. CHEVALIER FSG-B818 machine is equipped with an automated vision guidance tool, which enables it to track the motion of wafer as they move along the table. This asset is designed to reduce the time necessary for user to check and correct the working area. Last but not least, FSG-B818 model is backed by CHEVALIER reliable after-sales service. The company provides customers with regular technical support, troubleshooting advice and maintenance services, helping customers maintain their wafer grinding, lapping and polishing equipment in top condition for longer periods of time.