Used CHEVALIER SMART-B1640II #9265541 for sale

CHEVALIER SMART-B1640II is a state-of-the-art wafer grinding, lapping and polishing equipment designed for use in semiconductor and optoelectronic device manufacturing. The system utilizes an advanced robotic loading and unloading unit to significantly reduce operator fatigue and improve production efficiency. The machine can process wafers up to 17.3 inches (440mm) in diameter and up to 0.4 inches (10mm) in thickness. It is equipped with two high-speed grinding/polishing positions, a single lapping position and an integrated robotic loading/unloading tool. The grinding/polishing heads feature a precision spindle drive asset and high-torque DC servo motors for superior speed control and accuracy. The model is capable of grinding/polishing at rates up to 35mm per minute and lapping at up to 60mm per minute. The grinding/polishing heads are also capable of easily handling different pad sizes and shapes for greater flexibility. The equipment also features automatic process monitoring and control to ensure a consistent product. This system provides the capability to accurately and quickly monitor and control process parameters such as grinding pressure, polishing force, and wafer rotation speed. This ensures consistent part quality and repeatability. The integrated robotic loading unit, meanwhile, offers superior ergonomics, enabling batch loading and unloading for proficient operation. The machine also seamlessly integrates with other CHEVALIER processing systems to maximize production throughput. SMART-B1640II combines easy setup, precise control, and low maintenance to deliver the highest levels of performance for wafer grinding, lapping and polishing operations. It is an ideal solution for device manufacturers looking for extremely precise, high speed, automatic processing.