Used CHEVALIER SMART-B1640II #9265542 for sale

CHEVALIER SMART-B1640II
ID: 9265542
Vintage: 2013
Multi function surface grinder With accessories Power: 415 VAC, 3 Phase, 80 A, 33 kW 2013 vintage.
CHEVALIER SMART-B1640II is a high-tech wafer grinding, lapping and polishing equipment designed to produce round or flat wafer surfaces at high accuracy and repeatability levels. This system utilizes a PLC controller with advanced touch screen user interface for flexibility and easy operation and parameter setup. SMART-B1640II is equipped with optically driven positioning technology and automatic, computer-controlled spindle head movement for accurate, precise and repeatable material removal. The unit also has a variable speed spindle motor, up to a maximum speed of 5,800 rpm, that ensures the best possible surface finish. The 7-inch LCD screen allows for easy monitoring of the grinding and polishing progress. The wafer chuck is a vacuum-controlled base with an external screw-in mechanism to hold the wafer firmly during machining and ensure orthogonality and constant contact pressure between the grinding/lapping/polishing wheel and the wafer. The wafer holder has a 9-inch maximum clearance and can be outfitted with additional accessories for additional wafer sizes and mounting methods. CHEVALIER SMART-B1640II utilizes high-precision diamond grinding/lapping/polishing tools. The tooling can be changed with minimal setup time due to the built-in quick chuck device. The machine also offers advanced process control, with selective grinding capability in both up and down directions, and cycle times as low as 0.5 seconds per cycle. SMART-B1640II is equipped with a range of safety features that help protect from accidents and injuries. These features include an emergency stop button, an after-rotate device and a protective cover for the grinding/lapping/polishing wheel. The tool is also equipped with air purification and anti-condensation insulation to protect the wafer and the tools. Overall, CHEVALIER SMART-B1640II is a powerful and reliable wafer grinding, lapping and polishing asset that offers excellent accuracy and repeatability as well as safety features to protect users and materials. This model is ideal for applications where high precision and repeatability are required.
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