Used CHICAGO 45813 #9197736 for sale

CHICAGO 45813 Wafer Grinding, Lapping & Polishing Equipment is a comprehensive grinding, lapping and polishing system for assorted wafer thicknesses. It is used for ultra-precision grinding and lapping up to atomic force microscope (AFM) standard. The unit consists of a low-vibration spindle, diamond grinding and lapping wheels, and a low-perturbation polishing platen. The spindle is designed for high performance and low-vibration operations. It utilizes a brushless DC motor with commutated rotor position sensors, as well as a high-resolution feedback machine for regulating speed. Its patented spindle design has a bearing-free suspension that minimizes heat generation and enables faster, more accurate grinding. It also increases accuracy and stability during operation, while maintaining low-vibration levels. The diamond grinding and lapping wheels utilize both diamond resin and metal bond wheels for efficient grinding and lapping operations. The rougher diamond resin wheel is designed to quickly and accurately define the contours of a wafer, while the finer diamond metal bond wheel is used to achieve the highest quality of flatter surface. The wheels feature an adjustable speed range, offering superior surface finishes with minimal time and effort. The polishing platen is designed to polish the top surface of the wafer without generating any further vibrations. Its low-perturbation design ensures that the polishing process is non-destructive and that the surfaces are preserved. It utilizes a variable speed range to accommodate both soft and hard materials, offering versatility and a consistent surface finish. Overall, 45813 Wafer Grinding, Lapping & Polishing Tool offers superior control and flexibility for a wide variety of wafer lapping and polishing operations. It is designed to achieve maximum accuracy and optimal surface finish with minimal vibrations and perturbations. This asset is ideal for precision wafer grinding, lapping, and polishing applications.