Used CHIPTON HS-R30 #9391002 for sale

CHIPTON HS-R30 wafer grinding, lapping & polishing equipment is an effective and efficient solution for achieving superior surface finishes on wafers. The system is designed for high-precision abrasive polishing processes for wafers of all types, ranging from single crystal silicon to SiC, GaN, GaAs, and more. HS-R30 is capable of high-speed material removal, scratch-free flatness and extremely uniform surface finishes. CHIPTON HS-R30 unit features a dual side-surface grinding spindle that blasts away high-speed particles across the entire wafer surface. To ensure a consistent grinding result, the machine is equipped with a digital spindle speed control unit and a digital display to monitor and control the spindle speed. Additionally, the tool is equipped with a process monitoring device to minimize the grinding overshoot. The lapping asset on HS-R30 consists of a high-precision and adjustable base plate, which precisely holds the wafer in the required position and angle. The model is also equipped with a powerful air jet to maintain a high-precision constant velocity across the entire lapping surface. With the adjustable three-axis stages, the equipment offers a large range of motion and can achieve outcomes with a high degree of planarity and accuracy. CHIPTON HS-R30 also comes with a selection of polishing tools, including trimmers, brushes, sheets, and discs, which can be adapted to achieve the desired results. The system is equipped with an automatic tool position setting device for accuracy and repeatable performance. HS-R30 also has an atomization unit that helps to regulate the amount of polishing pressure applied to the wafer. Additionally, a vacuum unit helps to remove any extra abrasive particles that may be present during polishing processes. Overall, CHIPTON HS-R30 is a reliable, high-precision wafer grinding, lapping and polishing machine which can produce superior surface finishes with accuracy and repeatability. With its effective and efficient process management and adjustable features, the tool can adapt to many applications and deliver results of the utmost quality.