Used CINCINNATI 2 #134548 for sale

CINCINNATI 2 equipment is a highly advanced, high-precision wafer grinding, lapping and polishing system designed for the specialized needs of manufacturing and fabrication industries. Each unit is tailored to the customer's individual needs and is fully-automated for maximum efficiency. 2 machine is capable of grinding, lapping and polishing wafers up to 6 inches in diameter with a maximum surface roughness and scratch depth of CINCINNATI 2.5 and 1.2 microns respectively. The wafers can be ground to a tolerance of 0.02 mils and the tool is capable of producing highly precise grinding, polishing and lapping results suitable for the most demanding and intricate of wafer-processing applications. The asset is equipped with a high-performance control unit, which provides the user with complete control over the grinding, lapping and polishing processes. This includes the ability to adjust homogeneous grinding parameters such as wheel speed, wheel diameter and wheel pressure, as well as the option to set the desired rate of feed and force on the wafer. The control unit also allows for the calibration of the grinding wheel and tool parameters to the optimal settings for different wafer materials and processes. CINCINNATI 2 model also utilizes an advanced optical technique for wafer faceting and profiling. This allows for precise edge profiling of the wafers with a tolerance of 0.005 millimeters, as well as precise angle cut-off and flatness correction at the edges. This is accomplished using an optically-defined cutting process, which is fast and efficient. The equipment also offers several additional safety features, such as the ability to automatically detect the presence of foreign objects in the machine, a safety-stop button, and a one-time access control feature, which requires users to enter a password prior to advancing beyond a certain point in the grinding, lapping or polishing process. Finally, 2 system features a compact, yet robust design, allowing for efficient use in almost any workspace. Installation is relatively straightforward and requires minimal setup, making it ideal for laboratories who need to quickly setup and deploy wafer grinding capability.