Used CINCINNATI 2MT #134535 for sale

CINCINNATI 2MT is a heavy-duty, multi-tasking wafer grinding, lapping and polishing system designed for microelectronics device manufacturers. It is the latest addition to the range of advanced grinding technologies from CINCINNATI. 2MT features the latest version of diamond grinding, lapping and polishing technology which can be deployed to accurately profile a wide range of substrates such as advanced semiconductor materials, glass, and flexible substrates. The system is powered by a robust, state of the art CNC controller and a powerful, low-maintenance motor that can quickly create clean and accurate surfaces. The user can adjust the grinding wheel tension and speed to adapt to different substrates and wide range of applications. There are also external cooling water flow and coolant customization options that add value when precision surface processing is desired. CINCINNATI 2MT has an adjustable, microfine working surface which is designed for faster and more accurate polishing and single-sided flatness. There is also a laser alignment and process monitoring system built in to ensure tight control over the entire surface processing process. 2MT also features a modular design, allowing for the user to reconfigure the machine to adapt to varying production runs and processes. Integrated caliper monitoring is provided to ensure tight tolerances are achieved. Additionally, an atmospheric dust-extraction unit is provided to prevent dust contamination. CINCINNATI 2MT is an ideal solution for high-precision surface processing of microelectronics materials, offering tight tolerances, and a reduced environmental impact. Users are also provided with a variety of digital support options to ensure they are able to take full advantage of its capabilities. All of these options combine to make 2MT an ideal choice for microelectronics device manufacturers.