Used CINCINNATI 325-12 #9043075 for sale

CINCINNATI 325-12 Wafer Grinding, Lapping & Polishing is a two-platform equipment designed to provide advanced capabilities for finishing three-dimensional wafers. It can be adapted to different wafer sizes, from 100mm to 280mm, and is designed to offer process capabilities from rough grinding to polishing in a single step or within a multiple step sequence. The system incorporates a high accuracy grinding spindle, controlling the force that is necessary to maintain a constant grinding pressure during the grinding operation. This provides more consistent results and can improve the process yield. The unit is also equipped with a vacuum controller which monitors the vacuum pressure, enuring a steady vacuum during the grinding operation. The Lapping & Polishing machine is based on a platen design which allows the lapping and polishing procedures to be performed efficiently and quickly. It enables the accurate determination of material removal rates and testing conditions prior to production. The platens have generally a ceramic surface, and a lapping path of variable lengths is possible depending on the application. The Automation of CINCINNATI 315-12 tool is controlled by a logic module, providing interfaces for manual operation, automatic operations, diagnostic purposes and remote operation. The asset is designed for superior performance, ensuring the best possible result for the grinding, lapping and polishing operations. In addition, the model can be configured with a range of options to fulfill the needs for specific applications. These may include an on-board sample handling for the transport of wafers between the two spindles, a special sensor to measure the wafer surface during the grinding process, or an additional dynamic balancing equipment to reduce vibration and noise. Thus, 325-12 Wafer Grinding, Lapping & Polishing provides a refined, consistent and reproducible finish on three-dimensional wafers. With its sophisticated combination of grinding, lapping and polishing in one platform, the system can deliver high level of performance for various surface finishes with repeatable results.