Used CINCINNATI MILACRON R-327 #172012 for sale

CINCINNATI MILACRON R-327 is a wafer grinding, lapping & polishing equipment ideal for the precise processing of wafers from 200mm to 300mm in size. Featuring an automated system that includes adjustment free grinding mode and pinless encoder controlled speed regulation, it produces precise flat, edge, planar and surface lapping. It is an incredibly reliable continuous processing unit that offers repeatable performance of an exceptionally high quality. R-327 features an adjustable masking station for blocking off areas of undesired processing, as well as a tape peel station. It is designed with the versatility to enable precision processing of many different types of wafers. The machine accommodates up to a 200mm single wafer or a 300mm carrier with up to 25 wafers in it. It also has the ability to switch between working with single or multiple wafers during operation. CINCINNATI MILACRON R-327 process is versatile and can deliver many different types of wafer results, including thin wafer applications, parylene deposition and pressure testing. It also has a wide range of grinding and polishing abrasives, providing excellent surface finish and quality, which is consistent and uniform. The machine's low cost of ownership and reliable operation is enhanced with a range of features, such as optional auto-stop functions, air-conditioned full enclosure with gasketed windows, variable speed control for grinding, lapping and polishing, and a static-free working environment. Additionally, R-327 is highly efficient, with a fully automated monitoring tool for each station, enabling users to maximize efficiency and minimize machine downtime. To ensure the accuracy of results, the asset provides users with a data capturing and logging function, allowing for further data collection and analysis. Additionally, CINCINNATI MILACRON R-327 has an easy-to-use front touch screen display, giving users clear and intuitive control over their process. For the ultimate accuracy and safety, R-327 is designed with an advanced safety model that ensures correct positioning, protection and control of the wafer. The equipment features both mechanical and electronic safety devices, plus an alarm and built-in safety functions to provide a secure working environment for operators. All in all, CINCINNATI MILACRON R-327 is a highly flexible and cost-effective wafer grinding, lapping and polishing system. With its impressive range of features and accurate performance, R-327 is the ideal unit for precision wafer processing.