Used CLARK MHT 1 #117113 for sale

CLARK MHT 1 is a wafer grinding, lapping and polishing equipment designed to provide ultra-precise surface finish, parallelism, and size on wafers of up to 300mm diameter. The system features an automated, integrated chuck unit, which eliminates the need for manual chucking of wafers. The grinding capability is enabled by a powerful 3HP, 2,200 rpm motor, which allows for up to 30 ft/minute foot speed and undulations of less than one nanometer. The machine is also equipped with a closed-loop dynamic process control, which enables a fully automatic grinding, lapping and polishing process for all applications. In addition to its grinding capabilities, MHT 1 also has the ability to perform lapping, using a wide array of lapping techniques, including pad, spray and chemical-mechanical polishing. The integrated chuck tool also makes it easy to transfer wafers between lapping stages and ensure consistent results, as well as the ability to perform different lapping stages at the same time. The asset is also equipped with a touch panel that allows the user to easily configure and control the model, track its performance and quickly adjust parameters to optimize results. The panel also allows for remote monitoring and controlling, meaning that the equipment can be operated from any computer, tablet or mobile device. Finally, CLARK MHT 1 is also designed to provide fast and reliable results. The system is designed to provide high throughput and accuracy, making it an ideal choice for high-precision, high-performance applications. With its integrated chuck unit, closed-loop dynamic process control, and its array of lapping techniques, MHT 1 is a highly versatile, reliable and cost-effective wafer grinding, lapping and polishing machine.