Used CLAUSING CSG-618 #9190982 for sale

CLAUSING CSG-618 is a robust and reliable wafer grinding, lapping, and polishing equipment capable of producing flat, smooth, and low defect surfaces on thin and thick substrates with minimal effort and cost. The system is capable of maintaining precise grinding and polishing control by providing auto-feed feedback and follow up on the grinding spindle contact-point movement, and its varied materiels holding ability makes it capable of handling different substrate sizes and shapes. The unit uses diamond abrasives as its grinding and polishing materials, ensuring that the wafer surface is polished to a superior finish. The machine's modular design and easy setup combined with its highly reliable operation help to improve manufacturing efficiency and reduce the time to complete a given task. The machine has four spindles driven by a powerful electric motor, providing excellent speed and performance, with a variable speed range of between 100-8500rpm. The entire machine is operated via a programmable logic controller (PLC) interface, allowing the user to easily adapt the tool to different settings and programs for different applications. CSG-618 is designed to provide precise and accurate grinding, lapping, and polishing operations even on the most difficult wafers, and its automated grinding and polishing control asset ensures that no manual intervention is required. The machine also provides a number of other features such as in-process observation via CCD camera, diagnostics, and data logging for controlling the critical grinding parameters. In addition, the machine has an advanced and highly advanced PLC interface which permits full interactivity between the user and the machine. CLAUSING CSG-618 is designed to provide maximum flexibility, precision, and reliability for advanced production requirements, making it an excellent choice for wafer grinding, lapping, and polishing operations.