Used CMT CGD-16B #293754690 for sale

CMT CGD-16B Wafer Grinding, Lapping & Polishing equipment is a high performance system designed for high speed precision grinding and polishing of silicon wafers. The unit uses CNC servo motors to enable precise control of grinding, lapping and polishing operations. The motors are capable of delivering high torque and low speed ranges for surface finishes below 5 nm. The user-friendly automation interface allows operators to control parameters such as carrier speed, grinding and polishing force, and material feed rate with just a few clicks. This machine also offers the ability to grind and lap at different angles for greater accuracy and precision. CGD-16B is designed for superior performance and reliability. It features an all metal construction with stainless steel pedestal for superior corrosion resistance. It also comes with an advanced touch panel interface for easy operator control and programming. The tool is powered by an 8 hp variable frequency drive, allowing for a wide range of speeds for greater control. The machine features a powerful cooling asset to keep the grinding surface cool and prevent any damage to the wafer being polished. The model includes a unique nip roll which allows for steady flow of material over the grinding surface for improved polishing accuracy and uniformity. The equipment is designed to be energy efficient and offers an automatic shutdown feature if an overload is sensed in order to prevent damage. The grinding surface is kept clean with a motor driven cleaning brush which removes any debris from the grinding area. CMT CGD-16B is designed for high accuracy and precision grinding and polishing of silicon wafers. It offers an advanced touch panel interface for quick and easy operator control and programming. The powerful motor and nip roll design allow for a wide range of speed and smooth material flow over the grinding surface. It is energy efficient and provides an automatic shutdown feature if an overload is detected. The machine also comes with a powerful cooling system to prevent any damage to the wafer being polished.