Used CMV 5-25 #9045669 for sale

CMV 5-25 is a premium wafer grinding, lapping & polishing equipment designed to provide a combination of high precision, high material removal rates, and superior surface finish for a variety of industrial applications. The system consists of a high speed spindle assembly attached to a high precision XYZ stage that can be used to precisely position the workpiece in three dimensions. The spindle device operates in both clockwise and counterclockwise directions to provide controlled grinding, lapping, and polishing operations. The unit is built with a closed-loop servo motor machine, allowing for high accuracy and repeatability, and a high frequency spindle, for high speed operation. 5-25 tool provides high material removal rates with surface finishes as low as Ra 0.01 microns. The control asset is equipped with multiple program memories which can be used to store a variety of individual processes in order to enable repeatable and accurate results. Additionally, process cycles are quickly and easily programmed via the LCD touch-screen graphical user interface. Model safety is ensured with a number of safety features including a door interlock, motion-sensing safety switch, and power disconnect. The machine also comes equipped with an adjoining external pump and valve control console that can be used to provide a range of liquid-assisted applications. This equipment may be used for further precision-based processing such as back-lapping and water/chemical-assisted precision polishing. The pumps are also helpful for ejecting heat that is generated during high-speed grinding operations. In order to provide precise and repeatable system control, CMV 5-25 unit is designed with high-accuracy, multi-axis encoders that utilize capacitive and inductive measuring scales to ensure high performance. The machine also comes equipped with various amplifier and controller systems that provide high-speed, precise and repeatable motion control of the spindle along all three axes. 5-25 tool is the perfect solution for high-precision, high-material removal rate, and superior surface finish in industrial wafer-based applications such as grinding, lapping, and polishing. It provides unmatched precision, repeatability, and accuracy with the added benefits of easy programmability, greater safety, and the ability to incorporate liquid-assisted processes.