Used CMV 600 #9374991 for sale

CMV 600 Wafer Grinding, Lapping & Polishing Equipment is a state-of-the-art machine suitable for a variety of applications requiring precision machining of wafers and other precision surfaces. This system is perfect for a wide range of grinding, lapping and polishing applications for all types of wafers and substrate sizes. This unit utilizes a dental-grade electric motor and integrating machine that efficiently transmits torque while also providing precise application-oriented speed control. In addition, high-precision linear slides and digital servo feedback enable users to position the spindle for specific applications. The ergonomically designed control panel allows for easy adjustment of speed, acceleration and operation. Furthermore, the product's safety and aesthetic features provide users a controlled, comfortable, and dust- and debris-free working environment. 600 tool also incorporates a high-precision grinding spindle equipped with a variety of optional accessories and a polishing station that can be customized to meet specific requirements for various grinding and polishing operations. The standard accessories include a wheel dresser, a polishing wheel, and a finer polishing wheel for polishing any thickness of wafers. In addition, the asset's rinsing and cleaning station helps ensure all parts of the model are free from contamination. The high-level automation capabilities allows users to quickly set up and monitor grinding cycles, while the equipment's intuitive user interface also assists them during operation. In addition, the system incorporates a built-in data logging and collection unit to provide users with a comprehensive overview of the entire process. Finally, the machine is compliant with all applicable safety and operation standards, including Robotics Industry Association (RIA) and Occupational Safety and Hazards Agency (OSHA). CMV 600 tool helps create a cleaner and safer working environment for operators and also ensures optimal performance in the production process. This asset provides a precision, reliable, and precise grinding, lapping, and polishing model for any wafer, substrate, or other precision machining operations.