Used COBORN (Wafer Grinding, Lapping & Polishing) for sale

Wafer grinding, lapping, and polishing equipment manufactured by COBORN are highly advanced and designed to provide precise and efficient processing of wafers used in the semiconductor industry. These systems employ cutting-edge technology to achieve exceptional results while ensuring high-quality and accuracy. COBORN offers a range of wafer grinding, lapping, and polishing units, including the PL-4 and PL-5 models. The PL-4 is a compact solution suitable for small scale production and R&D applications. It incorporates a diamond grinding wheel, enabling precise material removal and surface finishing of wafers. The PL-5, on the other hand, is a versatile and fully automated system capable of handling larger volumes of wafers. It utilizes multiple grinding and polishing wheels, delivering efficient wafer processing. COBORN's wafer grinding, lapping, and polishing machines have several advantages. They provide excellent flatness and thickness control, ensuring uniformity across the entire wafer. The tools offer high precision and repeatability, enabling production of wafers with tight tolerances. Additionally, COBORN's assets are user-friendly, offering easy operation and maintenance. By utilizing COBORN's wafer grinding, lapping, and polishing models, semiconductor manufacturers can achieve improved yields, reduced production costs, and enhanced product quality. These equipment are essential for applications where wafer surface quality and precision are critical, such as in the production of microchips, LEDs, and MEMS devices.