Used COBURN 604 #9113445 for sale

COBURN 604 is a state-of-the-art wafer grinding, lapping and polishing equipment designed to bring advanced processing capabilities to the semiconductor industry. It utilizes a two-stage polishing process to create highly precise surfaces on semiconductor wafers. 604 is configured to process 1", 2", 2.5" and 3" wafers. It uses a heavy-duty grinding motor to initially grind wafers to the proper thickness. The grinding process is servo-controlled, allowing for precise thicknesses within a wide range. COBURN 604 then uses two independently-controlled polishers that spin in the same plane to create good, smooth surfaces. The adjustable-speed polishers allow for targeted re-surfacing of different areas of the wafer - enabling greater control and uniformity than typical grinding and lapping systems. After processing, the wafers are discharged from the system using an embedded CoolBell robotic unit. This eliminates the manual wafer handling associated with other systems, while providing increased yield. The machine's control software is designed for complete operator-friendly use. It offers easy programming and control, providing information on current Wafer and process status, as well as detailed process data interfaced with the appropriate process software. Programmable alarms notify the operator of any tool issues. The asset can also be equipped with a cassette-to-cassette interface capable of loading and unloading wafers without manual handling. 604 is also built to be easy to maintain and service. It features a modularized design that simplifies complete disassembly and part replacement, if necessary. It has an enclosed, dust-proof construction designed to maximize machine life and produce a high quality product. The model is also capable of being adapted to any environmental requirements. Overall, COBURN 604 is an advanced wafer grinding, lapping and polishing equipment that brings the latest technology to the semiconductor industry. Its features - including servo-controlled grinding, two-stage polishing, robotic wafer handling, and operator-friendly software - enable the production of highly precise semiconductor wafers. It provides increased efficiency, while minimizing manual handling and the resultant operational costs.