Used COBURN CMX 50 #9156303 for sale

COBURN CMX 50 wafer grinding, lapping & polishing equipment is specifically designed to enable the user to consistently achieve high precision and surface finish results in less time. This system provides advanced capabilities for processing semiconductor wafers in various stages of production. Equipped with up to three x-y grinding stations, the unit offers ultrasonic-assisted polishing, abrasive cleaning, and lapping to improve the process efficiency and yield. The machine is controlled by a powerful computer, enabling the user to keep track of the entire process and providing users with real-time process monitoring. It also allows the user to create custom recipes according to their process requirements. Additionally, the tool is capable of grinding, lapping, and polishing a variety of substrate materials, including metals, silicon, ceramics, and quartz. The main advantages of CMX 50 are its flexibility in terms of process implementations, its high precision, and its user-friendly interface. It comes with a asset-controlled abrasive dispenser, which ensures uniform application of abrasives, minimizes tool wear, and increases abrasive life. Furthermore, its very linear motion control model makes it easy to produce the desired surface finish and shape in a short period of time. The equipment is equipped with a precision spindle system, which allows for the execution of high accuracy rotational and linear motion applications for precise grinding. This ensures that the user can achieve the desired precision results time and time again. The unit also includes dual-level sensors, allowing for different depths of grinding. The machine is designed to be reliable, durable, and easy to use. It is designed to be low maintenance and long-term operation. COBURN CMX 50 comes with a comprehensive user manual to provide detailed instructions regarding its installation and operation, thereby ensuring that the user is able to maximize the tool's performance. Overall, CMX 50 wafer grinding, lapping & polishing asset is an ideal solution for improving the accuracy and surface finish of wafers. It is designed to provide the highest level of precision and finish in less time and with less effort. With this model, users can expect to achieve consistent and repeatable results that meet the highest level of quality standards.