Used COBURN CMX 50 #9245010 for sale

COBURN CMX 50 Wafer Grinding, Lapping and Polishing equipment is an advanced production system for application requirements of flat, thin and delicate substrates. This unit combines an ultra-precision grinding wheel head with a micro-positioning and lapping stages for a faster, more accurate and economical production process. The grinding wheel head utilizes a unique segmented design which allows for high accuracy grinding and polishing of delicate components with minimal strain and stress on the materials. The Grinding wheel head features precision motors with a highly accurate air bearing construction for exacting positioning. It also has adjustable speed control as well as adjustable grinding force for coarse and fine grinding. Additionally, this wheel head has an integral dust collection machine that helps reduce contamination and a built-in cooling tool to control temperature. The lapping and polishing stage of CMX 50 provides high precision surface finish and eliminates defects in substrates. It is equipped with a micro-positioning table for precise positioning of the substrate as well as a high-accuracy rotary lapping plate. The rotary lapping plate is adjustable for speeds up to 300 rpm and can handle substrates that range from 0.6 to 12.7 mm thick with a maximum size of 150 mm in diameter. COBURN CMX 50 can handle large production runs of a variety of wafers and substrates. This asset's accurate, automated process enables high speeds, improved precision, decreased cycle times, and increased throughput. CMX 50 is the perfect choice for high accuracy grinding, lapping, and polishing of delicate wafers and substrates for optical, optoelectronic, SEM, and high-performance integrated circuits. It is also suitable for demanding nanofabrication requirements.