Used COSMO 36SP4H #293606209 for sale

COSMO 36SP4H is a wafer grinding, lapping and polishing equipment that is ideal for use in the semiconductor industry. The system is capable of precision processing of wafers up to 8" in diameter, allowing for high accuracy and uniformity in the desired material removal. The unit is quite robust and durable, making it suitable for long production runs without interruption or downtime. The machine's main components include an abrasive grinding machine, an adjustable polishing head, an adjustable lapping head, a workpiece holding mechanism, a chip-removal tool, as well as a fully automated, self-seeking machine cycle. The abrasive grinding asset consists of two independent diamond cup wheels and is designed to deliver a high-precision material removal rate according to the customer's specific process applications. The adjustable polishing head is designed to provide constant force and angle throughout the polishing process. The adjustable lapping head is designed to provide maximum uniformity for customers requiring a high level of accuracy in their lapping processes. The workpiece holding mechanism utilizes a hydraulic clamping model, ensuring a secure and stable workpiece. The chip-removal equipment consists of two rotary brushes, which are capable of removing any accumulated debris during the operation cycles. The fully automated, self-seeking cycle is designed to improve the consistency of the mechanical polishing process, reducing cycle time and improving safety. 36SP4H is capable of accepting various types of water-soluble fluids for use in the grinding and lapping process and is able to regulate the pressure, flow rate and temperature for optimal results. The system was designed to meet various stringent safety requirements, such as low noise, vibration and air pollution levels, as well as key environmental standards for emission control and energy efficiency. COSMO 36SP4H is a cutting-edge wafer grinding, lapping and polishing unit, capable of delivering superior results while taking safety, convenience, and precision to the highest levels. It is an ideal machine for fulfilling the requirements of the semiconductor industry and can provide an effective and efficient solution for processing wafers.