Used CREATIVE 36 DPAW-TIN-T0295R #9388472 for sale

CREATIVE 36 DPAW-TIN-T0295R Wafer Grinding, Lapping & Polishing Equipment is an industrial-grade device designed for high volume wafer processing. This system is driven by two heavy-duty 5HP spindles, providing high torque capabilities for machining and polishing a variety of materials. The dual spindles are capable of spinning at variable speeds and are linked to an onboard computer-controlled PLC, allowing for precise and simultaneous grinding, lapping, and polishing of multiple wafers. 36 DPAW-TIN-T0295R offers a superior grinding, lapping, and polishing capability with high precision results. It is designed to deliver a top-notch finish with finest surface points measured in nanometers. It is engineered to tackle the most sophisticated wafer processing requirements and can be easily integrated with different automation solutions. The unit is enclosed in a stainless steel cabinet and features an advanced design that eliminates the need for oiling and reduces noise and vibration levels. The device also features flexibility and versatility in terms of mountings. The two-axis motorized manual table allows for easy loading and unloading of wafers and can be adjusted to a variety of angles. A variety of tools and accessories are available to customize the machine for specific needs. This feature allows for the use of various sizes, shapes, and thickness to be processed. The tool also includes a barometric chamber for an optimal working environment and a video monitoring asset to monitor progress. The included sophisticated software package features a graphical user interface with a simple desktop layout for easy access of all device functions. The software also allows for the programming and control of multiple parameters such as speed, feed rate, and vacuum settings. The program also allows for programming of grinding and polishing patterns, as well as data logging to review wafer performance. CREATIVE 36 DPAW-TIN-T0295R is the perfect solution for high-volume wafer processing, offering advanced grinding, lapping, and polishing capabilities with superior precision. It is ideal for high-precision industries such as semiconductor manufacturing, automotive, biomedical, and other delicate fields. The device provides a dependable, easy-to-use solution to get the job done quickly and efficiently.