Used CREATIVE 50 GPAW-TD #9388473 for sale

CREATIVE 50 GPAW-TD wafer grinding, lapping & polishing equipment is a high-precision, automated process which is used to transform the surface of a wafer into a flat, defect-free surface with a high-grade finish. The system ensures efficient processing of multiple wafers with uniform polishing, high throughput and excellent repeatability. It has been specifically designed for research and tool development and uses advanced technologies such as four heads oscillating grinding and advanced lapping & polishing technology. The unit incorporates an automated precision head and exclusive multi-head technology, which allows for simultaneous grinding and lapping of multiple wafers. The ergonomic design allows for easy operation and quick setup changes. The advanced control machine is highly intuitive and provides a graphical user interface for effective process control. Additionally, it includes an internal monitoring tool to allow full control and documentation of the process and results. The performance of the asset is further enhanced by the ability to adjust the individual grinding and lapping processes for each wafer, while also saving setup information for future operations. The machine uses a wet grinding model that supports processing of up to four wafers at a time. This feature is equipped with a powerful abrasive material that can be used for various wafer sizes as well as different requirements for shape and microstructure. The equipment also works with super-abrasive lapping and polishing materials as well as diamond polishing pads. The system uses advanced polishing techniques that maintain both a low removal rate and surface defects throughout the entire process. The unit also incorporates advanced automation technology to enable efficient wafer handling, monitoring, and safety. It comes with an automated loading/unloading station for incoming and outgoing wafers, and can be extended with other automated processes. It has an integrated PLC (Programmable Logic Controller) that provides an intuitive process control machine that helps to streamline the operation and ensure uniform quality of the wafers. Finally, it has a built-in safety tool that monitors process parameters during each stage of the process to ensure quality, protect the operators from potential hazards, and extend the asset's longevity. 50 GPAW-TD wafer grinding, lapping & polishing model is a great choice for research and tool development due to its highly automated processes and precise performance. It ensures uniform quality wafers and excellent repeatability of processes in order to meet the most rigorous quality needs. Its ergonomic design, along with its integrated monitoring systems and safety measures, guarantee reliable operation and maximum customer satisfaction.