Used CREATIVE 50 GPAW-TD #9388475 for sale

CREATIVE 50 GPAW-TD
ID: 9388475
Single side polisher.
CREATIVE 50 GPAW-TD is a fully automated, multi-purpose wafer grinding, lapping and polishing (GPL) equipment that is ideal for precision surface finishing applications. Utilizing an integrated diamond-disc-stone assembly, this system efficiently removes amorphous layers from the silicon wafer while controlling the grinding and lapping process for optimal results. The diamond disc and stone assembly consists of five separate components which allow for high efficiency and precision. The diamond disc is the primary grinding and lapping component which provides the required uneven surface, or "htmlized" finish, for the silicon wafer. It consists of multiple diamond grits of different sizes and purities that have been securely fixed to the surface of the disc via a various bonding agents; this ensures the long-term stability of the diamond disc and a reliable and precise finish. The other components of the unit include a mechanical stone polish arm, a stone conditioner, an abrasive conditioning disc, and an optional safety guard. The stone polish arm is used to rotate the diamond disc at a controlled speed and to mobilize the stone polisher while simultaneously polishing the silicon wafer. The stone conditioner connects the stone polisher to the diamond disc and ensures that it always remains in proper contact with the disc. The abrasive conditioning disc rotates at a very high speed and precisely strips the diamond disc of any foreign material. 50 GPAW-TD is also designed with safety features to protect the user from heat generated during the grinding and lapping process. The optional safety guard is a fine-meshed protective screen positioned around the disc that will quickly dissipate heat that is generated by the diamond disc and keep the user safe. In addition, the diamond disc is carefully inspected before every wafer processing to ensure that it is free from defects and any contamination. Overall, CREATIVE 50 GPAW-TD is an easy to use and reliable machine for wafer grinding, lapping and polishing applications. With its precision grinding and polishing components and its convenient safety features, this tool offers a cost-effective solution for any precision surface finishing work.
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