Used CREATIVE TECHNOLOGY 12B #9266985 for sale

CREATIVE TECHNOLOGY 12B is a wafer grinding, lapping and polishing equipment designed for applications that require high precision and accuracy. It is capable of grinding and polishing multiple semiconductor wafers simultaneously with a consistent and repeatable process. 12B system offers a wide range of lapping and polishing heads and accessories. A precision motion control unit allows precise diamond tools to be employed to achieve superior results. CREATIVE TECHNOLOGY 12B machine consists of a main frame and lapping/polishing head. The main frame has a three-axis motorized gantry for precise motion control of the lapping/polishing head in the x, y & z-axis directions. 12B also offers a servo motor-controlled Z-axis which allows for accurate and precise movement of the lapping/polishing tools. The lapping/polishing head contains eight diamond polishing heads and four diamond lapping heads, allowing for a wide variety of operational settings. CREATIVE TECHNOLOGY 12B tool has a fully-automated process control asset which regulates the operation of the lapping/polishing heads and controls the flow rate, grit, polishing and lapping parameters, and other necessary settings. Process setup can be customized to provide an accurate and repeatable result. The model also features an auto-scan feature which scans the wafer surface to monitor the progression of the polishing/lapping process, and adjusts the parameters accordingly. The equipment is equipped with a consumables management unit to maximize the life of the diamond discs and minimize the maintenance need. 12B also has built-in coolant filtration, and an active tensioning system for maintenance and re-tensioning of the diamond tools. These built-in features result in a smooth and consistent operation of the unit, providing superior results for precision wafer grinding, lapping and polishing applications. CREATIVE TECHNOLOGY 12B is compatible with wafer substrates of up to 2" (50.8mm) in diameter, allowing various sizes and thicknesses to be handled. The machine is designed and developed for applications such as fabrication of micro-processors, memory chips, power transistors and other semiconductor components. With its advanced lapping/polishing techniques, 12B provides superior accuracy and precise repeatability, making it an ideal solution for wafer fabricated products.