Used CREATIVE TECHNOLOGY 16B #9292349 for sale

CREATIVE TECHNOLOGY 16B is a comprehensive wafer grinding, lapping and polishing equipment that is designed to fulfill specific production requirements for high-precision and ultra-flat semiconductor wafer fabrication. The system consists of four modules: Grinding, Lapping, Polishing and Cleanroom. The Grinding Module uses a precision grinding wheel to achieve sub-micron accuracies. It is capable of performing grinding operations on 150mm, 200mm, and 300mm diameter wafers. The grinding wheel is manufactured from high-grade materials and accurately maintains its dimensions throughout the grinding process. The Grinding Module also includes a vacuum chucking unit that securely holds the wafers for accurate grinding and efficient removal of debris. The Lapping Module utilizes an elliptical lapping tool to lap or smooth the wafer surface. This tool is driven by a high- torque motor and is designed to generate a smooth, flat surface on the wafer. The lapping tool has adjustable speed to allow the user to set the ideal operating conditions and maximize the effectiveness of the lapping process. The Polishing Module is designed to achieve a high-degree of flatness and mirror-like finish. This includes a polishing wheel that is used to polish the wafer surface. The Polishing Module also includes a high-precision metrology machine to measure the accuracy of the polished surface. Finally, the Cleanroom Module is used to maintain wafers clean from contaminants and dust particles. The Cleanroom Module provides a controlled environment inside the tool to ensure that the wafer surface is kept clean throughout the fabrication process. Overall, 16B wafer grinding, lapping, and polishing asset exceeds the requirements for high-precision and ultra-flat wafer fabrication. It's comprehensive modular design and advanced process capabilities ensure that the model can effectively and consistently produce extremely accurate and reliable wafer products.