Used CREATIVE TECHNOLOGY 20B #9388431 for sale

CREATIVE TECHNOLOGY 20B wafer grinding, lapping & polishing equipment is designed for precise backside grinding, lapping and polishing of wafers. It is the ideal choice for utilization in process development, production operations, universities and other research institutes. Its construction has been optimized to ensure precise process control and uniform, high quality applications. 20B wafer grinding, lapping & polishing system features a grinding/polishing platform that is enclosed to ensure a sterile environment and maximum safety, with an integrated safety shield for added protection. Its powerful Rotating carrier unit is the heart of the machine, with a broad speed range, adjustable depth of grinding and adjustable leveling for even the most delicate wafer processing. To ensure repeatable and reliable results, the unit also includes fine powder deposit metering and precise batch temperature control. The machine also allows for alterations to grinding/polishing conditions during the operation, such as various speeds and grain sizes, feed rates, pressure ranges, and lapping temperatures for maximum process control. Additionally, CREATIVE TECHNOLOGY 20B wafer grinding, lapping & polishing tool is designed for easy calibration and maintenance with several built-in loops to ensure a reliable, repeatable process. The asset is entirely PLC controlled and comes with an integrated HMI interface that allows for programming, operation, and monitoring of the machine. It is also equipped with a comprehensive, intuitive touch-screen control module for ease-of-use in the workplace, including complete data logging and process adjustment records. 20B wafer grinding, lapping & polishing model also features an automated cleaning equipment, allowing technicians to focus on other tasks as the system handles the finishing of large production batches. The lapping and polishing chamber and its heating elements operate on an independent temperature control unit, keeping each wafer at its optimal temperature for a consistent end product. Overall, CREATIVE TECHNOLOGY 20B wafer grinding, lapping & polishing machine is a comprehensive tool designed for sophisticated operations and designed to meet the demanding needs of the entire microelectronics industry. With its precise process control and uniform, high quality applications, it offers a cost-effective solution to efficient, safe wafer manufacturing.