Used CREATIVE TECHNOLOGY 36 DPAW #9361670 for sale

CREATIVE TECHNOLOGY 36 DPAW is an automated wafer grinding, lapping, and polishing equipment that is designed for processing a wide range of wafer sizes. The system is capable of consistently grinding and polishing up to 36 wafers in a single operation. Using a diamond lapping and polishing unit, 36 DPAW is equipped to generate flat results to within 0.10um (surface) flatness. A digital touch screen control panel on the machine makes it easy to set various lapping/polishing angles, pressure settings, and tool parameters for each application. The control panel includes all parameters related to the lapping/polishing process. For wafer grinding, CREATIVE TECHNOLOGY 36 DPAW utilizes a high-torque motor and dual-platen base to allow exact control of grinding pressure for precision micro-machining. An adjustable grinding head and adjustment controls ensure precise alignment with the desired angle. The asset utilizes an array of abrasive grinding tools and polishing pads to produce the desired specifications. The lapping and polishing process is accomplished by using an abrasive pad to gently lap the wafers. As the abrasive material on the pad moves across the wafer, the diamond lapping and polishing process removes material from the wafer sides in a predetermined pattern. For each lapping step, the model applies an adjustable pressure which precisely controls the cutting force, particle concentration, and thickness of the layer of material to be removed. 36 DPAW equipment utilizes a particle scrubbing technology to ensure uniformity of particle velocity and to reduce particle embedding and contamination during the lapping and polishing process. As the abrasive media are rotated, fluidized particles suspended in a liquid solution are propelled away from the media surfaces and readily removed during the scrubbing cycle. After scrubbing, the fluidized particles are collected in a waste container to reduce environmental impact. Following the lapping and polishing process, CREATIVE TECHNOLOGY 36 DPAW automatically rinses and cleans the wafers using a high-pressure spray system. This high-pressure wash removes any residue, contamination, or debris that may remain on the wafer surfaces. Following the wash, a blow-off cycle quickly dries the wafers and helps to speed up the production process. 36 DPAW is an extremely versatile and powerful unit that is designed to provide efficient and reliable wafer grinding, lapping, and polishing. With its powerful motors, user-friendly controls, and its reliable particle scrubbing and rinsing systems, CREATIVE TECHNOLOGY 36 DPAW is ideal for today's most demanding wafer processing environments.