Used CREATIVE TECHNOLOGY 36 GPAW #9363391 for sale

CREATIVE TECHNOLOGY 36 GPAW is a flexible, high-precision wafer grinding, lapping and polishing equipment which is engineered to deliver superior uniformity and performance. The system enables the user to cover a wide variety of grinding and polishing tasks, and to handle large wafers (up to 36" diameter) with precision and accuracy. The GPAW features a direct drive multi-speed motor and an advanced digital control unit, allowing the user to precisely control the spindle speed and pressure. The spindle speed can be precisely adjusted between 0-1500 rpm for variable speed effects, and the pressure can be adjusted between 0-2.4 psi to meet the user's application requirements. The main shaft runs on two precision ceramic bearings which are precisely balanced for the best possible performance. The machine offers a wide variety of polishing options for different wafer materials, including Magnetic Diamond Disk (MDD) technology. With MDD technology, the user can achieve optimum polishing results more quickly and efficiently. The GPAW also has several available custom options which can be added to the tool to tailor it to various customer needs. These options include a variety of additional diamond disks, a second control station, a variety of interchangeable wafer holders, and other custom features. The asset also features EZRETURN, an advanced automation model which provides cycle tracking for wafer movement. This top-level automation enables faster return rate and more efficient production of both single-sided and double-sided wafers. Additionally, the equipment is equipped with SPI-LINK, a powerful networking system which enables remote monitoring of the unit's operation. Overall, 36 GPAW is a powerful, highly advanced machine designed to help the user maximize the production of difficult-to-grind and polishing applications. With a range of adjustable parameters, custom options, and intelligent automation, the tool offers a comprehensive and efficient solution for efficient, high precision wafer grinding, lapping, and polishing.